Description
To present the results of a survey taken concerning future applications for high-temperature electronics and sensors.A survey was conducted to start collecting information needed to better identify how a common set of high-temperature components and component standards might meet the most market needs crossing industry boundaries.
Product Details
- Published:
- 10/15/2012
- File Size:
- 1 file , 120 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
