Description
Proceedings from Electronics Assembly Expo held October 27-29, 1998, Providence, RI. Selected by the industry program committee, these 60 papers cover topics such as BGA Assembly, design for BGA and CSP, soldering, high density interconnect, PCB fabrication trends and more
Product Details
- Published:
- 11/01/1998
- Number of Pages:
- 800
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
