Description
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Product Details
- Edition:
- 1.0
- Published:
- 03/22/2002
- Number of Pages:
- 35
- File Size:
- 1 file , 1.3 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
