Description
Applies to semiconductor devices (discrete devices and integrated circuits) – and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
Product Details
- Edition:
- 1.0
- Published:
- 09/30/2002
- Number of Pages:
- 49
- File Size:
- 1 file , 1.7 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
