Description
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Product Details
- Edition:
- 1.0
- Published:
- 08/07/2003
- Number of Pages:
- 27
- File Size:
- 1 file , 570 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
