Description
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. To be read in conjunction with PD ES 59008-1
Cross References: ES 59008-1*ES 59008-2*ES 59008-4*ES 59008-5*ES 59008-6-1*ES 59008-6-2*IEC 60191 *IEC 61360-1:1995*EIA/JESD30-B*EIA/JEP95*BS 3934*
Product Details
- Published:
- 12/15/1999
- ISBN(s):
- 0580357597
- Number of Pages:
- 14
- File Size:
- 1 file , 390 KB
- Product Code(s):
- 19978933, 19978933, 19978933
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
