ASTM B943-05 PDF

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Standard Specification for Zinc and Tin Alloy Wire Used in Thermal Spraying for Electronic Applications
standard by ASTM International, 11/01/2005

Document Format: PDF

Description

1.1 This specification covers zinc and tin alloy wire, including zinc-aluminum, zinc-aluminum-copper, zinc-tin, zinc-tin-copper and tin-zinc, used as thermal spray wire in the electronics industry.

1.1.1 Certain alloys specified in this standard are also used as solders for the purpose of joining together two or more metals at temperatures below their melting points, and for other purposes (as noted in Annex A1). Specification B 907 covers Zinc, Tin and Cadmium Base Alloys Used as Solders which are used primarily for the purpose of joining together two or more metals at temperatures below their melting points and for other purposes (as noted in the Annex part of Specification B 907). Specification B 833 covers Zinc and Zinc Alloy Wire for Thermal Spraying (Metallizing) used primarily for the corrosion protection of steel (as noted in the Annex part of Specification B 833).

1.1.2 Tin base alloys are included in this specification because their use in the electronics industry is similar to the use of certain zinc alloys but different than the major use of the tin and lead solder compositions specified in Specification B 32.

1.1.3 These wire alloys have a nominal liquidus temperature not exceeding 850°F (455°C).

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.

Product Details

Published:
11/01/2005
Number of Pages:
4
File Size:
1 file , 79 KB
Note:
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