Description
Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
Product Details
- Edition:
- 1.0
- Published:
- 12/19/2001
- Number of Pages:
- 41
- File Size:
- 1 file , 1000 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
