Description
This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).
All packaged semiconductor devices, thin film circuits, acoustic wave devices, optoelectronic devices, hybrid integrated circuits (HICs), discrete, and multi-chip modules (MCMs) containing any of these devices as well as unpackaged singulated bare die, and die which are still part of a wafer are to be evaluated according to this standard.
Product Details
- Published:
- 2023
- ISBN(s):
- 1585373435
- ANSI:
- ANSI Approved
- Number of Pages:
- 56
- File Size:
- 1 file , 1.2 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
